Standards Chair, IEEE Consumer Electronics Society;
Director of Engineering, O & S Services
William Lumpkins, Senior Member of IEEE is the IEEE Consumer Electronics Society Standards Chair and is the Director of Engineering for O & S Services, an Engineering Services company specializing in Consumer Product development with bringing ideas in the U.S. to fruition and bridging the manufacturing process into the Far East. William also works for Wi2Wi Inc. as their lead technical consultant helping integrate Wi-Fi, GPS, and Blue Tooth into multiple projects for various customers. He served in the United States Navy from 1987 ~ 1996.During his active duty and while serving aboard the USS Carl Vinson, William actively studied Electrical Engineering/Computer Science and received his BS from New York University, Albany, 1996. While in a master’s program at University of Maryland, Far East Division, Japan; William taught classes for University of Maryland & Central Texas College from 1993 ~ 1998.
IEEE SA member 2007~2012
REGIONS: Region 5 MPAC Coordinator 2005~2007
SECTIONS/CHAPTERS: Dallas Section Activities Chair (2004, 2005), Dallas EMC Chapter Vice Chair (2004), Founded Dallas CE Chapter Chair (2004, 2005, 2011, 2012), Founded Dallas I&M Chapter (2009), and Silicon Valley CE Chapter Program Committee member (2008). Silicon Valley Section PACE Chair (2008).Silicon Valley Section Education Chair (2006, 2007)
STUDENT BRANCHES: Helped to establish the following Student chapters UC Santa Cruz, Pennsylvania State, George Mason University
SOCIETY: Consumer Electronics Society Vice President 2006; CE Society President 2007, 2008; CE Society Vice President of Publications 2009, CE Society Standards Chair 2010, 2011, 2012; IEEE CE Society Magazine Associate Editor; IEEE CE Society RFID Liaison (2009~2012)
TEXAS INSTRUMENTS 2000-2006
Director of Engineering, SAT, OMAP, Wireless Terminal Business Unit
Led team of eight Sr.Hardware/Software engineers on two continents in the re-use and development of a Linux based software tool to provide first level screening of defects in OMAP (16xx, 17xx, and 242 x). Interfaced with various teams and customers to solve production issues and reduce TI’s expense as related to compensation requests for customers. Improved test capability of remote FAE sites to provide fast cycle time recovery and improved customer satisfaction.
- Developed Hardware and software solutions for evaluating Customer product returns and worked with customers remotely and on-site to resolve production stop issues with their cellular products.
- Re-utilized existing software development platform (ARM 11 & DSP6000), and modified Linux OS based test suite for Silicon level testing.
- Deployed across multiple country sites to reduce test time and improve customer relationships.
- Active technical manager in resolving Cellular Phone design issues with customers and TI production.
- Resolved production line stop issues with Motorola & SKTT cell production lines.
- Trained junior engineers in Failure Analysis theory and Root Cause analysis of RMR units.
- Setup Power Analysis test system for advance power analysis debug.
- Created USB test verification system to evaluate increasing number of USB returns from World Wide Customer Base.
- Interfaced with OMAP CTO to provide insight in future OMAP technologies that affect the Digital Home & Military COTS market opportunities.
, Dallas, TX 2003-2005
Director of Engineering
, NBD, Broad Band Communications Group
Evaluated new technologies and IP to expand Texas Instruments IP portfolio, participated in Industry Liaison groups to ensure that new guidelines and specification reflected the company’s technology strategy. Developed a Software Development platform based on ARM926 with C6xxx DSP for Set Top Box and Digital Media Adapter, consumer electronic markets. This platform was used to introduce and validate TI’s entry into DLNA and UPnP.
- Managed 2 million annual budget for Advanced R&D activities in CE market place.
- Led IP acquisition team for FIOS & HomePNA ventures within TI
- Led Software / Hardware Design reviews to ensure project leads could learn from my example in developing team management skills.
- Elected DLNA Compliance Test Chair: led a diverse group of companies to develop a Compliance Test program to ensure conformance to the DLNA guidelines.
- Past CTS Chair (also Compliance Test Team lead before the sub-committee formed)
- Developed Plug fest system modeling off USB & UPnP Plug fest concepts.
- Negotiated contract with Intel for use of NMPR Test Suite Framework
- Negotiated and led CTT vendor selection team and initial $1million contract with Lamprey
- Worked with Plug Fest Chair & VTM in Plug Fest Site selection
- Worked behind the scenes with Japanese companies in Japanese to secure the “Japanese Vote” before actual standards meetings, worked with European companies and US companies after meetings in social settings to secure votes to allow TI’s IP to become prevalent in the standard.
- Presented at DLNA general meetings updates and status reports
- Past CTF chair
- Negotiated content license agreements with Nokia, Panasonics, TI, Intel, Sony and Coding Technologies
- Negotiated million dollar contract for the development DLNA’s Standard (Guideline) Compliance Test tool.
- Negotiated contract with Baylor University for encoding of MPEG content.
- Negotiated deal with the UPnP SC & Microsoft for the development of the Control Point Test tool for verification of UPnP 1.0.
- Performed validation of test content and reviewed potential test tools for DLNA 1.0 test content verification.
- Interfaced with CTO’s of Intel, Sony, Panasonic, Microsoft, Dolby, Walt Disney, AOL, and Dell in developing DLNA’s Standards (Guidelines).
- Led efforts to establish ICV (Independent Compliance Vendors) for long term Standards Compliance
- Hosted 1st DLNA plug fest in Dallas Texas
- Represented TI as UPnP Audio Video Committee member, UPnP Security WG, UPnP Remote WG
- Developed UPnP AV specification with TI IP considerations in mind for inclusion in the DLNA Guidelines
- Instrumental in TI being elected to the UPnP Steering Committee.
- Used “Soft Skills” to earn respect and trust by BOD members to allow TI to join the Steering Committee; Executive committee for setting UPnP standards direction.
, Dallas, TX 2000-2003
Sr. Hardware Engineer
, USB, Peripherals Division
Led a multi-organization team in the validation and verification of high-speed USB products, while mentoring six engineers; team leader in the validation of a high speed USB to mass storage bridge device. RTL development platform and verified RTL in lab environment with logic analyzers and oscilloscope to verify timing and protocol adherence. Developed evaluation boards with schematic capture software and worked with board layout engineer to streamline high speed signaling and performed ESD and EMI testing on EVM’s. Developed supporting documentation and acted as a liaison between design resources and customers.
MINOLTA SYSTEMS LABORATORY
- Key interface with internal departments to coordinate the use of TI silicon in projects throughout TI and directed sub-contractors/consultants in the development of silicon blocks. Created FPGA (APEX II 600C)
- Negotiated contracts with vendors and 3rd party suppliers for the continued production of EVM’s for TI’s distributions center.
- Analyzed EMI data of Microsoft’s XBOX sub-systems, resolving a FCC certification issue allowing Microsoft to launch the X-Box gaming system.
- Created XBOX wireless (Blue Tooth) game pad controller and base station.
- Designed USB to UART/RS-232 PDA dongle board for customer reference design.
- Designed the 1st HS USB bus powered HD by using a unique powering sequence and firmware.
- Designed USB 2.0 HS/FS to ATA/ATAPI/Compact Flash board and received the USB logo.
- Wrote 8051/8052 microcontroller and EMI/ESD design guide for high-speed designs.
- Represented TI within the USB test compliance committee and in the Mass Storage Working group.
- Serve as a technical leader in the field of USB compliance, evaluating new IP designs and validating robustness of the IP for future TI products.
(Now Konica-Minolta), San Jose, CA 1999-2000
Sr. Hardware Engineer
, Laser Printer Division
Managed a team of 30 software, quality assurance engineers and technicians in product design and production. Designed printer controllers utilizing an FPGA to create an ASIC with USB 1.1, ATA (IDE), PCI, and SDRAM controller, 1394 (Fire Wire), 10/100 Ethernet, SH2 (7044), PowerPC (405GP), SDRAM, and VxWorks as the RTOS.
- Led design from concept to board creation, debug, EMI/ESD compliance and to production.
- Interfaced with parts suppliers/vendors to negotiate prototype ordering and production availability.
, Japan 1996-1998
Managed a team of six electrical and five software engineers in developing telecommunication products and printer controllers for the Japanese consumer sector. Managed sales/marketing product requirements and designed products utilizing 68K, MPC860 processors for telecommunications and the printer market in support of Toyota, Motorola, NTT Docomo, Cannon, and Fujitsu.
- Designed ISDN, ATM, Ethernet Router/Switch for SOHO applications (used MPC860SAR)
- Designed Cannon printer 100Base-T interface board, utilizing FPGA and MPC860 CPU.
- Designed Fujitsu printer interface board, converting 16-bit video into dual 32 bits.
- Designed one and two port RS-232 to 10 Base-T routers, two port parallel to 100 Base-T Print Server.